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TB62801FG 2006-06-14 1 toshiba bi-cmos integrated circuit silicon monolithic TB62801FG linear ccd clock driver the TB62801FG is a clock distribution driver for ccd linear image sensors. the ic can functionally drive the ccd input capacitance. it also supports inverted outputs, eliminating the need for crosspoint control. the ic contains a 1 to 4 clock distribution driver for the main clock and 4-bit buffers for control signals. the suffix (g) appended to the part number represents a lead (pb) -free product. features ? high drivability: guaranteed driving 450 [pf] load capacitance @fclock = 20 [mhz] ? operating temperature range: ta = ? 25c to 60c pin connection (top view) weight: 0.5 g (typ.) 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 2b_in cp_in v cc gnd v cc ck_in sh_in rs_in 2b_out cp_out gnd sh_out rs_out 2b_ out
TB62801FG 2006-06-14 2 logic diagram pin description pin no. pin name functions remarks 1 2b_ out light-load drive output (inverted) driver output for ccd last-stage clock 2 2b_in light-load drive input driver input for ccd last-stage clock 3 cp_in light-load drive input ccd clamp gate driver input 4 v cc power supply D gnd ground D 5 v cc power supply D 6 ck_in heavy-load drive input driver input for ccd transfer clock 7 sh_in light-load drive input ccd shift gate driver input 8 rs_in light-load drive input ccd reset gate driver input 9 rs_out light-load drive output (not inverted) ccd reset gate driver output 10 sh_out light-load drive output (not inverted) ccd shift gate driver output 11 heavy-load drive output (not inverted) driver output for ccd transfer clock 12 heavy-load drive output (inverted) driver output for ccd transfer clock gnd ground D 13 heavy-load drive output (inverted) driver output for ccd transfer clock 14 heavy-load drive output (not inverted) driver output for ccd transfer clock 15 cp_out light-load drive output (not inverted) ccd clamp gate driver output 16 2b_out light-load drive output (not inverted) driver output for ccd last-stage clock ck_in cp_out cp_in sh_out sh_in rs_out rs_in 2b_in 2b_ out 2b_out
TB62801FG 2006-06-14 3 truth table input output l h h 2b_ out l l l 2b_in h 2b_out h l l cp_in h cp_out h l l h h l h ck_in h l l l sh_in h sh_out h l l rs_in h rs_out h absolute maximum ratings (ta = 25c) characteristic symbol rating unit power supply voltage v cc ? 0.5 to 7.0 v input voltage v in ? 1.2 to v cc +0.5 v output voltage v o ? 0.5 to v cc v input clamp diode current (v i < 0) i ik ? 50 ma output clamp diode current (v o < 0) i ok ? 50 ma high level i oh (o/ o) ? 16.0 ma output current excluding other than , outputs low level i ol (o/ o ) 16.0 ma high level ioh ( / ) ? 100 ma output current low level iol ( / ) 150 ma operating temperature topr ? 25 to 60 storage temperature t stg ? 40 to 100 junction temperature t j 150 power dissipation p d 1.5 w note: output current is specified as follows: v oh = 4.0 v, v ol = 0.5 v.
TB62801FG 2006-06-14 4 recommended operating conditions characteristic symbol min typ. max unit power supply voltage v cc 4.7 5.0 5.5 v input voltage v in 0 ? v cc v output voltage v o 0 ? v cc v high level i oh (o/ o ) ? ? ? 8.0 ma output current excluding , outputs low level i ol (o/ o) ? ? 8.0 ma high level i oh ( / ) ? ? ? 20.0 ma output current (note) low level i ol ( / ) ? ? 20.0 ma operating temperature t opr ? 25 25 60 c input rise/fall time t ri /t fi ? 2.5 5.0 ns note: output current is specified as follows: v cc = 4.7 v, v oh = 4.5 v, v ol = 0.2 v. input rise/fall time is specified as 10 % to 90 % of waveform amplitude. electrical characteristics dc characteristics (unless otherwise specified, v cc = 4.7 to 5.5 v, ta = ? 25 to 60c) characteristic symbol test circuit test condition v cc min typ. max unit high v ih ? 4.7 2.0 ? v cc input voltage low v il 1, 2 ? 4.7 0 ? 0.8 v input clamp voltage v ik 3 i ik = ? 30 ma 4.7 ? ? 1.0 v i oh = ? 10 ma 4.7 4.5 ? v cc i oh = ? 50 ma 4.7 4.0 ? v cc v oh ( / ) 4, 5 i oh = ? 300 ma 4.7 2.5 ? v cc i ol = 100 a 4.7 0 ? 0.2 i ol = 50 ma 4.7 0 ? 0.5 output voltage v ol ( / ) 6, 7 i ol = 300 ma 4.7 0 ? 2.5 v i oh (o / o) = ? 4 ma 4.7 4.5 ? v cc v oh (o/ o) 4, 5 i oh (o / o) = ? 16 ma 4.7 4.0 ? v cc i ol (o / o ) = 4 ma 4.7 0 ? 0.2 output voltage excluding , outputs v ol (o/ o) 6, 7 i ol (o / o) = 16 ma 4.7 0 ? 0.5 v input voltage i in 8 v in = v cc or gnd 5.5 ? ? 1.0 a total i cc 9 outputs: high or low outputs: low or high other outputs are high 5.5 ? ? 15.0 static current consumption each bit ? i cc 10 one input: v in = 0.5 v other inputs: v cc or gnd ? ? ? 1.5 ma output off mode supply voltage v por ? see description on next page. ? ? 3.0 ? v
TB62801FG 2006-06-14 5 output low-level fixed mode at power-on to avoid malfunction at power on, this ic incorporates the following functions: ? all outputs are fixed to low level until v cc reaches more than 3 v. ? when v cc reaches 3 v (typ.), internal logic depends on input signals. ? v cc must be more than 4.7 v for normal operation. ac characteristics (input transition rise or fall time: t r /t f = 2.5 ns) normal temperature/ v cc = 5.0 v all temperatures/ v cc = 4.7 to 5.5 v characteristic symbol test condition min typ. max min max unit reference measurement diagram c l = 450 pf 7.0 10.0 14.0 7.0 16.0 t plh ( / ) c l = 350 pf 6.0 9.0 13.0 6.0 15.0 c l = 450 pf 7.0 10.0 14.0 7.0 16.0 t phl ( / ) c l = 350 pf 6.0 9.0 13.0 6.0 15.0 ns measurement diagram 1 c l = 30 pf 3.0 5.0 7.0 2.5 8.0 t plh (o/ o) c l = 15 pf 2.0 4.0 6.0 1.5 7.0 c l = 30 pf 3.0 5.0 7.0 2.5 8.0 propagation delay time t phl (o/ o ) c l = 15 pf 2.0 4.0 6.0 1.5 7.0 ns measurement diagram 2 output skew excluding , outputs t o (skw) c l = 30 pf 0 ? 2.0 ? 2.0 ns measurement diagram 3 output crosspoints ( 1/ 2) v t (crs) c l = 300 to 450 pf ? ? ? 1.5 ? v measurement diagram 4 power v cc dut output signal waveform pulse generator additional circuit (p.o.r) test circuit output signal waveform gnd supply voltage 3 v v cc time low-level state
TB62801FG 2006-06-14 6 waveform measuring point propagation delay time setting input signal ? 2b_in ? ck_in ? sh_in ? rs_in ? cp_in measurement diagram 1 output signal ? output signal ? measurement diagram 2 output signal ? 2b_out ? cp_out ? sh_out ? rs_out output signal ? 2b_out measurement diagram 3 output signal ? out _ b 2 ? 2b_out ? cp_out ? sh_out ? rs_out output waveform crosspoint/level setting measurement diagram 4 ? ? 10% 90% 1.5 v t ri 10% 90% 1.5 v t fi gnd 3.0 v v cc ? 0.5 v t plh (o) t phl (o) gnd + 0.5 v t phl ( o) t plh ( o) v cc ? 0.5 v gnd + 0.5 v v cc ? 0.5 v t plh ( 1) t phl ( 1) gnd + 0.5 v v cc gnd v cc gnd v cc gnd v cc gnd to (skw) to (skw) v ol v t (crs) v oh gnd t phl ( 2) t plh ( 2) v cc ? 0.5 v gnd + 0.5 v v cc gnd
TB62801FG 2006-06-14 7 reference data (typ. value) 1.6 0.0 0 25 150 0.2 0.4 0.6 0.8 1.4 100 1.0 mounted on test board ic only note: test board: 50 mm 50 mm glass-epoxy board. 1.2 50 125 75 1.4 0.0 0.0e + 0 5.0e + 6 1.0e + 7 2.0e + 7 0.2 0.4 0.6 0.8 1.2 1.5e + 7 1.0 power dissipation rise in temperature note: c l ( / ) = 450 pf, c l = (o/ o ) = 30 pf output amplitude = 4.5 v supply voltage = 5.5 v mounted on a 50 mm 50 mm glass-epoxy board 0 100 20 40 60 80 120 0 50 100 150 250 300 400 450 20 40 60 80 100 200 350 note: maximum operating frequency: under specified load conditions, the frequency when the pulse width of the output signal matches that of the input signal; or the frequency at which the specified amplitude is obtained. note that light-load bits are fixed to a capacitance of 30 pf. note: propagation delay time is in accordance with attached sheet. v cc = 5.0 v, ta = 25c, t ri /t fi = 2.5 ns 12 4 50 150 250 350 450 550 650 5 6 7 8 9 10 11 low-level output current i ol (a) p d (w) capacitance (pf) t plh ( ), t phl ( ) ? c l (characteristics of 1-output, other outputs: no load) propagation delay time (ns) capacitance (pf) load capacitance versus maximum operating frequency (all bits in operation) v cc = 5.0 v, ta = 25c, t ri /t fi = 2.5 ns frequency (mhz) rise in temperature (c) frequency (hz) frequency versus power dissipation, temperature (@all outputs: maximum load capacitance) power dissipation (w) ta ( c ) p d ? ta low-level output voltage v ol (v) / output i ol ? v ol high-level output voltage v oh (v) = 25c v cc = 4.7 v 0.0 ? 1.0 ? 5.0 ? 4.0 0.0 ? 0.8 ? 0.6 ? 0.2 ? 2.0 ? 0.4 ? 3.0 ? 1.0 ta = 25c v cc = 4.7 v (*) subtract amplitude voltage with v cc as reference.
TB62801FG 2006-06-14 8 test circuit dc parameters pins marked with an asterisk ( * ) are test pins. ground the input pins that are not being used as test pins so that their logic is determined. unless otherwise specified, bits of the same type are measured in the same way. ? v ih /v il (1) light-load drive bit (2) heavy-load drive bit 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v 0 to v cc 30 pf e.g., oscilloscope ? ? ? ? 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v 0 to v cc 450 pf e.g., oscilloscope ?
TB62801FG 2006-06-14 9 ? v ik note 1: when measuring input pins, connect the input pins that are not being measured to gnd. ? v oh (o/ ) 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? ? ? ? v ? 30 ma ? 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v v ? ? ? ? ? ? o output: ? 4/ ? 16 ma output: ? 10/ ? 50/ ? 300 ma
TB62801FG 2006-06-14 10 ? v oh ( o / ) ? v ol (o/ ) 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? ? v o output: ? 4/ ? 16 ma output: ? 10/ ? 50/ ? 300 ma ? 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? ? ? ? ? ? o output: 4/16 ma output: 100 a/50/300 ma v 4.7 v
TB62801FG 2006-06-14 11 ? v ol ( o / ) ? i in note: when measuring input pins, connect the input pins that are not being measured to gnd. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? ? ? o output: 4/16 ma output: 100 a/50/300 ma v 4.7 v 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 5.5 v ? ? ? 5.5 v a a ? ?
TB62801FG 2006-06-14 12 ? i cc note 1: the input logic of the heavy-load drive clock input pin (pin 6) is the same for high or low. ? ? i cc note 2: when measuring input pins, connect the input pins that are not being measured to gnd or power. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 3 v ? 5.5 v a ? 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0.5 v ? ? v cc a
TB62801FG 2006-06-14 13 ac parameters pins marked with an asterisk ( * ) are test pins. ground the input pins that are not being used as test pins so that their logic is determined. unless otherwise specified, bits of the same type are measured in the same way. ? propagation delay time (1) light-load drive bit (2) heavy-load drive bit 15/30 pf e.g., oscilloscope 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0 to 3 v ? ? v cc ? ? ? 350/450 pf e.g., oscilloscope 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0 to 3 v ? ? v cc ? ?
TB62801FG 2006-06-14 14 ? light-load drive output skew ? heavy-load drive output crosspoints 30 pf e.g., oscilloscope 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0 to 3 v ? ? v cc ? ? ? 30 pf 30 pf 30 pf 30 pf c l e.g., oscilloscope 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0 to 3 v ? ? v cc ? ? c l c l c l c l = 300 to 450 pf
TB62801FG 2006-06-14 15 example of an application circuit (1) connection to the tcd1503c note: driving the ccd requires a lot of power. toshiba recommends using a bypass capacitor connected to the 5 v power supply to stabilize voltage. precautions on use this ic does not include built-in protection circuits for excess current or overvoltage. if the ic is subjected to excess current or overvoltage, it may be destroyed. therefore systems incorporating the ic should be designed with the utmost care. particular care is necessary in the design of the output, v cc and gnd lines since the ic may be destroyed by short circuits between outputs, air contamination faults, or faults due to improper grounding. v cc gnd 2b_in 16 15 14 13 12 11 10 9 1 2 3 4 22 5 6 7 8 21 20 19 15 14 13 12 ss nc 2e ss 1e nc 9 10 11 os1 18 17 16 nc cp 2b sh rs ss os2 10 20 nc nc cp 2b rs od signal output 1 signal output 2 12 v 1 2 3 4 gnd 5 6 7 8 cp_in v cc ck_in sh_in rs_in 2b_out cp_out sh_out rs_out 2b_ out 5 v last transfer clock signal input clamp gate signal input transfer clock signal input shift gate signal input reset gate signal input 5000 tcd1503c 1
TB62801FG 2006-06-14 16 (2) connection to the tcd1703c note: driving the ccd requires a lot of power. toshiba recommends the use of a bypass capacitor connected to the 5 v power supp ly to stabilize voltage. two TB62801FGs devices are used in this application: one is used to drive all the control bits and the four transfer clock bits , the other to drive the remaining four transfer clock bits. v cc gnd 2b_in 16 15 14 13 12 11 10 9 1 2 3 4 22 5 6 7 8 21 20 19 15 14 13 12 od nc 2e1 ss 1e2 sh 9 10 11 os1 18 17 16 2e2 1e2 2b rs cp ss os2 101 201 ss 202 102 2b rs cp signal output 1 signal output 2 12 v 1 2 3 4 gnd 5 6 7 8 cp_in v cc ck_in sh_in rs_in 2b_out cp_out sh_out rs_out 2b_ out 5 v last transfer clock signal input clamp gate signal input transfer clock signal input shift gate signal input reset gate signal input 7500 tcd1703c 1 v cc gnd 2b_in 16 15 14 13 12 11 10 9 1 2 3 4 gnd 5 6 7 8 cp_in v cc ck_in sh_in rs_in 2b_out cp_out sh_out rs_out 2b_ out 5 v
TB62801FG 2006-06-14 17 package dimensions hsop16-p-300-1.00 unit: mm weight: 0.5 g (typ.)
TB62801FG 2006-06-14 18 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
TB62801FG 2006-06-14 19 (5) carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly.
TB62801FG 2006-06-14 20 points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (tj) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
TB62801FG 2006-06-14 21 about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0.5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux restrictions on product use 060116eb a ? the information contained herein is subject to change without notice. 021023_d ? toshiba is continually working to improve the quality an d reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc. 021023_a ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. 021023_b ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_q ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of toshiba or others. 021023_c ? the products described in this document are subject to the foreign exchange and foreign trade laws. 021023_e

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